Benutzer-Werkzeuge

Webseiten-Werkzeuge


platinen

Unterschiede

Hier werden die Unterschiede zwischen zwei Versionen angezeigt.

Link zu dieser Vergleichsansicht

Beide Seiten der vorigen RevisionVorhergehende Überarbeitung
Nächste Überarbeitung
Vorhergehende Überarbeitung
platinen [2013/08/19 20:54] – [Links] olliplatinen [2025/03/19 06:35] (aktuell) – [Links] olli
Zeile 1: Zeile 1:
 ====== Platinen ====== ====== Platinen ======
 +Hinweise zu [[.:info:EMV|EMV-gerechtem]] Platinenlayout
 ===== Checkliste ===== ===== Checkliste =====
   * Text eingefügt?   * Text eingefügt?
Zeile 11: Zeile 11:
  
 ===== Links ===== ===== Links =====
-   * [[http://www.analog.com/library/analogdialogue/archives/39-09/layout.html|Bypasskondensatoren, Impedanz Leiterbahnen, Routing, etc.]] +   * [[http://www.basista.de/content/download/103/425/file/strombelastbarkeit_leiterbahnen.pdf|Strombelastbarkeit]]
-   * [[http://www.basista.de/download/strombelastbarkeit_leiterbahnen.pdf|Strombelastbarkeit]]+
    * [[http://www.mikrocontroller.net/articles/Leiterbahnbreite|Strombelastbarkeit (µC.net) Warum nicht verzinnen?]]    * [[http://www.mikrocontroller.net/articles/Leiterbahnbreite|Strombelastbarkeit (µC.net) Warum nicht verzinnen?]]
-   * [[http://www.ilfa.de/blobs/Design-Optimierung.pdf|Designoptimierungen]] 
-   * [[http://www.ti.com/lit/an/szza009/szza009.pdf|PCB Design Guidelines 
-For Reduced EMI, Appnote TI]] 
-   * [[http://www.fairchildsemi.com/an/AN/AN-389.pdf|Follow PC-Board Design Guidelines for Lowest CMOS EMI Radiation, Appnote Fairchild|]] 
    * [[http://ww1.microchip.com/downloads/en/AppNotes/00823a.pdf|Analog Design in a Digital World Using Mixed Signal Controllers, Appnote Microchip]]    * [[http://ww1.microchip.com/downloads/en/AppNotes/00823a.pdf|Analog Design in a Digital World Using Mixed Signal Controllers, Appnote Microchip]]
    * [[http://ww1.microchip.com/downloads/en/AppNotes/00688b.pdf|Layout Tips for 12-Bit A/D Converter Application, Appnote Microchip]]    * [[http://ww1.microchip.com/downloads/en/AppNotes/00688b.pdf|Layout Tips for 12-Bit A/D Converter Application, Appnote Microchip]]
-   * [[http://www.ultracad.com/article_outline.htm|Artikel von Douglas Brooks]] +   * [[https://web.archive.org/web/20210214010634/https://www.ultracad.com/article_outline.htm|Artikel von Douglas Brooks (via Waybackmachine)]] 
-   * [[http://alternatezone.com/electronics/files/PCBDesignTutorialRevA.pdf|PCB Design Tutorial von David L. Jones]] ([[http://www.ibfriedrich.com/Layout_Tutorial_d.pdf|deutsche Übersetzung]]) +   * [[https://www.scs.stanford.edu/~zyedidia/docs/pcb/pcb_tutorial.pdf|PCB Design Tutorial von David L. Jones]] ([[https://server.ibfriedrich.com/wiki/ibfwikide/images/3/3a/PCB_Layout_Tutorial_d.pdf|deutsche Übersetzung]]) 
-   * Successful PCB grounding with mixed-signal chips [[http://edn.com/design/analog/4394761/Successful-PCB-grounding-with-mixed-signal-chips---Part-1--Principles-of-current-flow|Part 1: Principles of current flow]][[http://edn.com/design/analog/4395817/Successful-PCB-grounding-with-mixed-signal-chips---Part-2--Design-to-minimize-signal-path-crosstalk|Part 2: Design to minimize signal-path crosstalk]][[http://edn.com/design/analog/4396382/Successful-PCB-grounding-with-mixed-signal-chips---Part-3--Power-currents-and-multiple-mixed-signal-ICs|Part 3: Power currents and multiple mixed-signal ICs]]+   * Successful PCB grounding with mixed-signal chips  
 +         [[http://edn.com/design/analog/4394761/Successful-PCB-grounding-with-mixed-signal-chips---Part-1--Principles-of-current-flow|Part 1: Principles of current flow]] 
 +         [[http://edn.com/design/analog/4395817/Successful-PCB-grounding-with-mixed-signal-chips---Part-2--Design-to-minimize-signal-path-crosstalk|Part 2: Design to minimize signal-path crosstalk]] 
 +         [[http://edn.com/design/analog/4396382/Successful-PCB-grounding-with-mixed-signal-chips---Part-3--Power-currents-and-multiple-mixed-signal-ICs|Part 3: Power currents and multiple mixed-signal ICs]] 
 +   * [[http://www.ti.com/lit/an/sprabb3/sprabb3.pdf|PCB Design Guidelines for 0.5mm Package-on-Package Applications Processor]] 
 +   * [[http://electronicdesign.com/analog/passive-components-aren-t-really-so-passive-part-3-pcbs| 
 +Passive Components Aren’t Really So Passive (Part 3): PCBs]] 
 +   * [[https://www.analog.com/media/en/training-seminars/design-handbooks/Basic-Linear-Design/Chapter12.pdf|Linear Circuit Design Handbook - Chapter 12: Printed Circuit Board (PCB) Design Issues]] 
 +   * [[http://docs.toradex.com/102492-layout-design-guide.pdf|Layout Design Guide (Toradex)]] 
 +   * [[https://www.analog.com/media/en/analog-dialogue/volume-39/number-3/articles/high-speed-printed-circuit-board-layout.pdf|A Practical Guide to High-Speed Printed-Circuit-Board Layout]] 
 +   * [[https://www.elektronikpraxis.vogel.de/pcb-design-regeln-sieben-suenden-beim-leiterplatten-design-a-356703/|Sieben Sünden beim Leiterplatten-Design]] 
 +   * [[https://www.ti.com/lit/an/scaa082a/scaa082a.pdf|High-Speed Layout Guidelines (TI)]] 
  
platinen.1376938446.txt.gz · Zuletzt geändert: 2013/08/19 20:54 von olli