====== Platinen ======
Hinweise zu [[.:info:EMV|EMV-gerechtem]] Platinenlayout
===== Checkliste =====
  * Text eingefügt?
  * Befestigungsbohrungen vorhanden? Abstände geprüft?

===== Empfehlungen für Maße (Prozess ohne Lötstopp, z.B. www.platinenbelichter.de) =====
  * Restring: 12mil
  * Isolate: >16mil
  * [[http://www.mikrocontroller.net/articles/Eagle_im_Hobbybereich#Empfehlungen_fuer_Leiterbahnen_im_Hobbybereich|Leitbahnbreiten]]

===== Links =====
   * [[http://www.basista.de/content/download/103/425/file/strombelastbarkeit_leiterbahnen.pdf|Strombelastbarkeit]]
   * [[http://www.mikrocontroller.net/articles/Leiterbahnbreite|Strombelastbarkeit (µC.net) Warum nicht verzinnen?]]
   * [[http://ww1.microchip.com/downloads/en/AppNotes/00823a.pdf|Analog Design in a Digital World Using Mixed Signal Controllers, Appnote Microchip]]
   * [[http://ww1.microchip.com/downloads/en/AppNotes/00688b.pdf|Layout Tips for 12-Bit A/D Converter Application, Appnote Microchip]]
   * [[https://web.archive.org/web/20210214010634/https://www.ultracad.com/article_outline.htm|Artikel von Douglas Brooks (via Waybackmachine)]]
   * [[https://www.scs.stanford.edu/~zyedidia/docs/pcb/pcb_tutorial.pdf|PCB Design Tutorial von David L. Jones]] ([[https://server.ibfriedrich.com/wiki/ibfwikide/images/3/3a/PCB_Layout_Tutorial_d.pdf|deutsche Übersetzung]])
   * Successful PCB grounding with mixed-signal chips 
         * [[http://edn.com/design/analog/4394761/Successful-PCB-grounding-with-mixed-signal-chips---Part-1--Principles-of-current-flow|Part 1: Principles of current flow]]
         * [[http://edn.com/design/analog/4395817/Successful-PCB-grounding-with-mixed-signal-chips---Part-2--Design-to-minimize-signal-path-crosstalk|Part 2: Design to minimize signal-path crosstalk]]
         * [[http://edn.com/design/analog/4396382/Successful-PCB-grounding-with-mixed-signal-chips---Part-3--Power-currents-and-multiple-mixed-signal-ICs|Part 3: Power currents and multiple mixed-signal ICs]]
   * [[http://www.ti.com/lit/an/sprabb3/sprabb3.pdf|PCB Design Guidelines for 0.5mm Package-on-Package Applications Processor]]
   * [[http://electronicdesign.com/analog/passive-components-aren-t-really-so-passive-part-3-pcbs|
Passive Components Aren’t Really So Passive (Part 3): PCBs]]
   * [[https://www.analog.com/media/en/training-seminars/design-handbooks/Basic-Linear-Design/Chapter12.pdf|Linear Circuit Design Handbook - Chapter 12: Printed Circuit Board (PCB) Design Issues]]
   * [[http://docs.toradex.com/102492-layout-design-guide.pdf|Layout Design Guide (Toradex)]]
   * [[https://www.analog.com/media/en/analog-dialogue/volume-39/number-3/articles/high-speed-printed-circuit-board-layout.pdf|A Practical Guide to High-Speed Printed-Circuit-Board Layout]]
   * [[https://www.elektronikpraxis.vogel.de/pcb-design-regeln-sieben-suenden-beim-leiterplatten-design-a-356703/|Sieben Sünden beim Leiterplatten-Design]]
   * [[https://www.ti.com/lit/an/scaa082a/scaa082a.pdf|High-Speed Layout Guidelines (TI)]]